blog posts $100 million center to drive smart, reconfigurable technologies Oct 1, 2019 1:30 pm Share on Facebook Tweet Email Sidney Lu (BS, ME '81, front third from left), CEO of Foxconn Interconnect Technology Ltd. joins other representatives from FIT and the University of Illinois to sign the FIT-Illinois R&D Center letter of intent during a signing ceremony at Engineering Hall in Urbana on July 1. Photo via grainger.illinois.edu. Images The University of Illinois at Urbana-Champaign’s Grainger College of Engineering and Foxconn Interconnect Technology (FIT) are partnering on a new $100 million Center for Networked Intelligent Components and Environments (C-NICE). Share on Facebook Tweet Email
