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Read the latest University of Illinois System news from the Office for University Relations.

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  • $100 million center to drive smart, reconfigurable technologies

    U of I and FIT Ltd officials

    Sidney Lu (BS, ME '81, front third from left), CEO of Foxconn Interconnect Technology Ltd. joins other representatives from FIT and the University of Illinois to sign the FIT-Illinois R&D Center letter of intent during a signing ceremony at Engineering Hall in Urbana on July 1. Photo via grainger.illinois.edu.

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